{"product_id":"modeling-and-design-of-electromagnetic-compatibility-for-high-speed-printed-circuit-boards-and-packaging-9780367573669","title":"Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging","description":"\u003cp\u003e\u003cstrong\u003e\u003cem\u003eModeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging\u003c\/em\u003e\u003c\/strong\u003e presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cp\u003eThis book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.\u003c\/p\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAuthor:\u003c\/b\u003e \u003ca href=\"https:\/\/sureshotbooks-com.myshopify.com\/search?type=product%2Carticle%2Cpage\u0026amp;q=AUTH-10659635\"\u003eXing-Chang Wei\u003c\/a\u003e\u003cbr\u003e\u003cb\u003ePublisher:\u003c\/b\u003e CRC Press\u003cbr\u003e\u003cb\u003ePublished:\u003c\/b\u003e 06\/30\/2020\u003cbr\u003e\u003cb\u003ePages:\u003c\/b\u003e 322\u003cbr\u003e\u003cb\u003eBinding Type:\u003c\/b\u003e Paperback\u003cbr\u003e\u003cb\u003eWeight:\u003c\/b\u003e 1.19lbs\u003cbr\u003e\u003cb\u003eSize:\u003c\/b\u003e 9.10h x 6.10w x 0.90d\u003cbr\u003e\u003cb\u003eISBN13:\u003c\/b\u003e 9780367573669\u003cbr\u003e\u003cb\u003eISBN10:\u003c\/b\u003e 0367573660\u003cbr\u003e\u003cb\u003eBISAC Categories:\u003c\/b\u003e\u003cbr\u003e- \u003ca href=\"https:\/\/sureshotbooks-com.myshopify.com\/search?type=product%2Carticle%2Cpage\u0026amp;q=CAT-COM\"\u003eComputers\u003c\/a\u003e | \u003ca href=\"https:\/\/sureshotbooks-com.myshopify.com\/search?type=product%2Carticle%2Cpage\u0026amp;q=BISAC-COM041000\"\u003eHardware | Chips \u0026amp; Processors\u003c\/a\u003e\u003cbr\u003e- \u003ca href=\"https:\/\/sureshotbooks-com.myshopify.com\/search?type=product%2Carticle%2Cpage\u0026amp;q=CAT-TEC\"\u003eTechnology \u0026amp; Engineering\u003c\/a\u003e | \u003ca href=\"https:\/\/sureshotbooks-com.myshopify.com\/search?type=product%2Carticle%2Cpage\u0026amp;q=BISAC-TEC008010\"\u003eElectronics | Circuits | General\u003c\/a\u003e\u003cbr\u003e- \u003ca href=\"https:\/\/sureshotbooks-com.myshopify.com\/search?type=product%2Carticle%2Cpage\u0026amp;q=CAT-TEC\"\u003eTechnology \u0026amp; Engineering\u003c\/a\u003e | \u003ca href=\"https:\/\/sureshotbooks-com.myshopify.com\/search?type=product%2Carticle%2Cpage\u0026amp;q=BISAC-TEC024000\"\u003eMicrowaves\u003c\/a\u003e\u003cbr\u003e\u003cbr\u003e\u003cp\u003e\u003cb\u003eAbout the Author\u003c\/b\u003e\u003cbr\u003e\u003c\/p\u003e\u003cp\u003eXing-Chang Wei received the Ph. D degree in electrical engineering from the Xi'an University of Electronic Science and Technology, China, in 2001. From 2001 to 2010, he was with the A*STAR Institute of High Performance Computing, Singapore, as a Research Fellow, Senior Research Engineer, and then Research Scientist. He received the 2007 Singapore Institute of Engineers Prestigious Engineering Achievement Award for his contribution to the development of a novel electromagnetic compatibility (EMC) measurement facility. In 2010, he joined Zhejiang University, Hangzhou, China, as a Full Professor, and received the New Century Excellent Talents Award from China's Ministry of Education.\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cp\u003eHis main research interests include power integrity and signal integrity simulation and design for high-speed printed circuit boards, through interposer vias analysis, and the development of fast algorithms for computational electromagnetics. He has more than 10 years research experience in the EMC modeling and design of high-speed printed circuit boards and packaging. He has authored\/co-authored more than 50 papers published in IEEE Transactions and IEEE international conferences in this area.\u003c\/p\u003e\u003cp\u003e\u003ci\u003eThis title is not returnable\u003c\/i\u003e\u003cbr\u003e\u003c\/p\u003e","brand":"CRC Press","offers":[{"title":"Default Title","offer_id":44576481968365,"sku":"9780367573669","price":95.98,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0550\/8097\/6621\/products\/img_73d71fe6-b4f6-4369-8d4c-d5c75a474667.jpg?v=1702011918","url":"https:\/\/sureshotbooks.com\/es\/products\/modeling-and-design-of-electromagnetic-compatibility-for-high-speed-printed-circuit-boards-and-packaging-9780367573669","provider":"SureShot Books Publishing LLC","version":"1.0","type":"link"}